Robin Gong · Engineering

Resume

Tsinghua University, B.E. Vehicle Engineering. Mechanical design, robotics, simulation, and physical testing.

U.S. citizen · Graduated June 2026

Resume text

Resume text

Robin Gong. Robotics and mechatronics engineer. U.S. citizen. Contact: robingong2002@gmail.com. LinkedIn: robingong7. Portfolio: robin-gong.com.

Education

Tsinghua University

Bachelor of Engineering in Vehicle Engineering, Beijing, China. Graduated June 2026.

  • Ranked 1st of 127 undergraduate theses in Vehicle Engineering.
  • Tsinghua University Outstanding Undergraduate Thesis Award, top 3%.

The Bishop's School

La Jolla, California. Graduated May 2021.

Experience

Panbotica, Robotics Systems Engineering Intern

Shenzhen, China. December 2025 to April 2026.

  • Built an online YOLO and VLM workspace monitor across a fleet of 150 robotic baristas, verifying object placement and detecting foreign objects between arm-motion steps. Interrupt-driven motion protection reduced company-reported collision-related support calls 80%, from five to one per week.
  • Built and deployed a customer-facing edge-to-cloud ASR, LLM, and TTS pipeline with function calling for voice ordering, FAQ responses, and POS payment QR-code display.

Zerith Robotics, Mechanical Engineering Intern

Shenzhen, China. July 2025 to November 2025.

  • Redesigned chassis motor mounts for a humanoid service robot in 200 units/month production, eliminating 5-axis undercut features for standard 3-axis CNC manufacturing.
  • Integrated a 6-axis wrist force sensor and resolved tolerance-stack assembly failures through interface redesign and GD&T.
  • Co-designed a thin 3-DOF neck under packaging constraints and produced engineering drawings for its patent filing.

BYD, Manufacturing Engineering Intern

Lancaster, California. September 2021 to January 2022.

  • Standardized electric-bus assembly work instructions and diagnosed electrical faults across multi-node CAN networks.

Projects

Zero-Carbon Power System for Long-Endurance UAVs

Senior thesis, Tsinghua University. September 2025 to June 2026.

  • Developed the first known ammonia-fueled two-stroke aviation engine for carbon-free, long-endurance UAV power.
  • Redesigned the stock cylinder head in SolidWorks from 3D scans, raising compression from approximately 10:1 to approximately 17:1.
  • Built custom two-stroke CONVERGE CFD models for three ignition architectures and selected dual-spark ignition from pressure and heat-release traces.
  • Manufactured and dyno-tested the dual-spark head, demonstrating pure-ammonia operation at approximately 2000 to 2500 r/min.

THU Racing Formula SAE Electrical Systems

Electrical Systems Engineer. September 2024 to June 2026.

  • Designed and built a 600 V-to-24 V, 450 W DC-DC converter PCB in Altium with approximately 93% simulated efficiency under racing loads.
  • Reduced total wiring length by more than 10 m by integrating the VCU, fuse box, and low-voltage battery into one module.

Automated Modular Cooking Robot

Lead Mechatronics Engineer. September 2024 to June 2026.

  • Built a Cartesian tool changer that automatically swaps food-processor blades for slicing, dicing, chopping, and julienne cuts.
  • Designed an Altium PCB for ESP32 stepper control and implemented PID and ROS inverse kinematics for a 3-DOF peeling arm.

Mars Exploration Robot

National Final 2nd Prize, China-U.S. Young Maker Competition. March 2024 to August 2024.

  • Built a four-legged robot that autonomously navigates with LiDAR-inertial SLAM and switches among sampling tools.
  • Designed and 3D-printed the chassis and legs and integrated an EEG interface for tool selection, sampling, and manual override.

Box Truck Conversion

November 2020 to September 2021.

  • Retrofitted a box truck into a motorhome, completing engine repair, electrical, solar, plumbing, furniture, and metal fabrication.

Skills

CAD and simulation: SolidWorks, Siemens NX, CATIA, ANSYS, CONVERGE CFD, MATLAB/Simulink, and GD&T.

Robotics and controls: ROS 2, CAN Bus, CAN logging, PID, motor control, and inverse kinematics.

Embedded and hardware: ESP32, Raspberry Pi, Altium Designer, schematic capture, PCB layout, and oscilloscope.

Software and AI: Python, C++, Linux, Git, Docker, YOLO, and vision-language models.

Fabrication: CNC machining, 3D printing, welding, soldering, and lathe.

For the technical scope and test results behind each project, explore the case studies.

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